Surface Mount Technology & DIP
Substrate types
Al2O3、AIN、FR4 and FPC
SMT Capability
- The smallest size of Capacitance and Resistor:01005 / 0402
- Minimum IC lead pitch:0.2 mm
- Minimum BGA ball pitch:0.35 mm
- Repeat accuracy: ±0.03 mm
- Lead-free production
- DIP (Dual in line package)
Total Quality Control
- 100% Stereo Microscope + Visual Inspection
- AOI (Automated Optical Inspection)