Surface Mount Technology & DIP

 

Substrate types

Al2O3、AIN、FR4  and FPC

 

SMT Capability

  • The smallest size of Capacitance and Resistor：01005 / 0402
  • Minimum IC lead pitch：0.2 mm
  • Minimum BGA ball pitch：0.35 mm
  • Repeat accuracy： ±0.03 mm
  • Lead-free production
  • DIP (Dual in line package)
 

Total Quality Control

  • 100% Stereo Microscope + Visual Inspection
  • AOI (Automated Optical Inspection)