Chip On Board
Chip on board, or COB process consists of three major steps: 1. Die attachment or Die mount 2. Wire Bonding and 3. Encapsulation of the die and wire.
Die Bonding Capability
- Chip Dimension：0.15* 0.15 mm ~ 100* 100 mm
- Repeat Accuracy：±33 um
Wire Bonding Capability
- Au wire：0.7 mil ~ 1.2mil
- Au wire repeat accuracy：±2.5 um
- Minimum Fine Pitch：35 um
- Al wire：0.7 mil ~ 2.0 mil, 5mil ~12 mil
- Al wire ：±2.5 um
1K class Clean-booth environment
- Clean suit
- Anti-static wrist straps
Totally quality management
- 100% Visual Inspection
- Wire pull-out test
- Stereo Microscope / Lamp10X